---
title: 祝贺壁仞科技成功上市，成为“港股GPU第一股” | 高榕新闻
titleEN: Congratulations to Biren Technology on Its Successful IPO, Becoming the
  "First GPU Stock in Hong Kong" | Gaorong Ventures News
hide: false
type: 新科技
typeEN: New Technology
createDate: 2026-01-02T13:55:00.000Z
abstract: 1月2日，壁仞科技在香港联合交易所主板挂牌上市，股票代码为06082.HK。作为港股2026年首只上市新股，壁仞科技发行价为每股19.60港元，募资规模55.83亿港元，开盘盘初涨幅扩大至118%，报42.88港元/股，总市值突破1000亿港元。此次成功登陆港交所，壁仞科技不仅成为“港股GPU第一股”，也是港股18C章特专科技公司上市机制落地以来发行规模最大的新股。
abstractEN: On January 2, Biren Technology was listed on the Main Board of The
  Stock Exchange of Hong Kong under the stock code 06082.HK. As the first new
  listing of 2026 in Hong Kong, Biren Technology priced its shares at HK$19.60
  each, raising a total of HK$5.583 billion. In early trading, the share price
  surged as much as 118% to HK$42.88, pushing the company's market
  capitalization above HK$100 billion. With this successful listing, Biren
  Technology not only became the "first GPU stock in Hong Kong" but also marked
  the largest IPO since the implementation of the Chapter 18C listing regime for
  specialist technology companies in Hong Kong.
content: >-
  1月2日，壁仞科技在香港联合交易所主板挂牌上市，股票代码为06082.HK。作为港股2026年首只上市新股，壁仞科技发行价为每股19.60港元，募资规模55.83亿港元，开盘盘初涨幅扩大至118%，报42.88港元/股，总市值突破1000亿港元。此次成功登陆港交所，壁仞科技不仅成为“港股GPU第一股”，也是港股18C章特专科技公司上市机制落地以来发行规模最大的新股。


  ![](/static/img/abstract_biren_20260102.jpeg)


  壁仞科技创始人、董事长兼CEO张文在上市致辞中表示：“这是一个更好的开始，也意味着肩负起更大的责任。未来，壁仞科技将持续加大研发投入，全力推进全栈自主可控产品研发迭代，构建起完善的国产算力体系，着力提升我国智算产业的安全、稳定与坚韧水平，引领并赋能人工智能产业高质量发展。”


  ![](/static/img/biren_0102.jpeg)


  高榕创投曾于2020年参与壁仞科技的Pre-B轮融资。壁仞科技也是高榕创投在过去12个月内第9家成功登陆港股的被投企业。


  **先进技术领导者：全栈自主可控**


  从2019年“壁立万仞”武夷山岩下立志、黄浦江畔起步，到今日香江鸣锣上市，壁仞科技六载全“芯”投入国产“芯程”，在通用大算力芯片领域开辟出一条自主创新之路——自主原创的芯片架构，构建全栈软件生态，引领大算力芯片Chiplet、光互连行业技术趋势，通过坚持打造原创高性能GPU软硬件体系，实现从高端AI芯片到算力集群的全链路自主可控。


  壁仞科技汇聚了全球近千名高精尖人才，积累了强大的专有技术及工程能力。他们在三年内将首款产品从设计推进至商业化，以卓越的产品性能，证明了壁仞科技拥有世界一流的研发效率。公开数据显示，截至2025年，壁仞科技在全球多个国家和地区累计申请专利1500余项，位列中国通用GPU公司第一，获得专利授权600余项，位列中国通用GPU公司前列；发明专利授权率达100%，位列国内企业发明专利授权率榜首。此外，壁仞科技两度荣获世界人工智能大会最高奖项SAIL奖，率先完成光互连技术商用部署，并获评为国家专精特新重点“小巨人”。


  ![](/static/img/biren_20260102-2-.jpeg)


  **国产算力赋能百业：迈入规模化增长新周期**


  凭借着实用、可靠、创新的产品及解决方案，壁仞科技产品已应用于AI数据中心、电信、AI解决方案、能源及公用事业、金融科技及互联网等关键行业，并已规模部署于全国多个智算集群，有效支撑人工智能训练、推理服务和科研创新等核心应用场景的算力需求。客户已覆盖九家财富中国500强企业（含五家世界500强），在三大运营商实现国产算力集群规模化商业落地，完成了从技术突破到市场验证的闭环。


  自2023年正式开启壁砺™芯片产品商业化开始，壁仞科技展现出强劲的增长势能。收入规模从当年的6203万元，迅速在2024年攀升至3.37亿元。随着壁砺™166芯片产品的量产入市，2025年壁仞科技再度实现跨越式增长。截至2025年12月15日，公司在手订单规模达12.41亿元。除现有产品组合外，壁仞科技将计划推出基于第二代架构开发的下一代旗舰数据中心芯片BR20X系列用于云训练及推理，预计2026年实现商业化上市，有望进一步释放巨大的市场潜能。


  **从跟跑到并跑：打造国产智能计算产业生态**


  2026年是“十五五”规划的开局之年。《“十五五”建议》将人工智能发展方向作为未来重点，全文提及8次“人工智能”，2次“算力”，要以人工智能引领科研范式变革，抢占人工智能产业应用制高点。


  我国深入实施“人工智能+” 行动，为人工智能算力芯片创造了广泛应用场景，各类算力芯片需求呈现爆发式增长。在响应国家战略以及国产替代加速的背景下，壁仞科技的技术实力与产品布局，契合了政策导向以及市场对自主可控算力的迫切需求。在此发展机遇下，壁仞科技此次港股上市提供筹集资金，将重点推进下一代产品迭代与技术创新，包括智能计算硬件的发展，以及软件平台的开发及升级以及智能计算解决方案的商业化等，以实现推动技术进步及加速人工智能应用的长期目标。


  站在全新的发展起点，壁仞科技将坚定不移地践行“国芯、国设、国造、国用”的战略使命，持续强化研发投入，提升核心技术自主可控水平，深化产业链协同创新，通过提供强大、高效、安全的算力基础设施，成为支撑国家数字经济与人工智能产业发展的核心力量。


  高榕创投创始合伙人岳斌表示，“高端通用智能芯片事业充满挑战，如同跨越壁立万仞的高山，需要穿越过技术和商业周期的成熟团队来领航。壁仞对行业发展的长周期、高难度有清晰的认知，同时在核心技术、人才、资金、生态等各个维度的综合能力出色。他们拥有长期向上攀登的勇气和底气，也是匹配这个时代、勇于立在潮头的进取型玩家。过去几年，壁仞充分验证了研发硬实力和产品可靠性，在商业化方面也有不俗的增长潜力。上市是新的起点，期待壁仞继续奔赴国产GPGPU和AI芯片生态的未来，不断突破计算的效率边界。”


  ![](/static/img/birem_20260102-3-.png)
contentEN: >-
  On January 2, Biren Technology was listed on the Main Board of The Stock
  Exchange of Hong Kong under the stock code [06082.HK](https://06082.hk/). As
  the first new listing of 2026 in Hong Kong, Biren Technology priced its shares
  at HK$19.60 each, raising a total of HK$5.583 billion. In early trading, the
  share price surged as much as 118% to HK$42.88, pushing the company's market
  capitalization above HK$100 billion. With this successful listing, Biren
  Technology not only became the "first GPU stock in Hong Kong" but also marked
  the largest IPO since the implementation of the Chapter 18C listing regime for
  specialist technology companies in Hong Kong.


  ![](/static/img/abstract_biren_20260102.jpeg)


  In his listing day speech, Zhang Wen, Founder, Chairman, and CEO of Biren Technology, said: "This is a better beginning, and it also means shouldering greater responsibility. Going forward, Biren Technology will continue to increase R&D investment, fully advance the development and iteration of full-stack, independently controllable products, build a comprehensive domestic computing power ecosystem, and strive to enhance the security, stability, and resilience of China's AI computing industry, while leading and empowering high-quality development of the artificial intelligence industry."


  ![](/static/img/biren_0102.jpeg)


  Gaorong Ventures participated in Biren Technology's Pre-B round financing in 2020. Biren Technology is also the ninth portfolio company of Gaorong Ventures to successfully list on the Hong Kong stock exchange within the past 12 months.


  **A Leader in Advanced Technology: Full-Stack Independent Control**


  From its founding in 2019—inspired by the spirit of "standing like a towering cliff" at the foot of Mount Wuyi and starting its journey on the banks of the Huangpu River—to today's listing ceremony on the shores of Hong Kong, Biren Technology has devoted six years of full "chip" commitment to the domestic chip journey. It has carved out a path of independent innovation in the field of general-purpose large-compute chips—through its proprietary original chip architecture, building a full-stack software ecosystem, and leading industry trends in large-compute chiplet and optical interconnect technologies. By persistently developing a high-performance GPU software and hardware system from the ground up, Biren has achieved full-link independent control, from high-end AI chips to computing clusters.


  Biren Technology has gathered nearly 1,000 top-tier talents from around the world and accumulated strong proprietary technologies and engineering capabilities. Within just three years, the company advanced its first product from design to commercialization, demonstrating world-class R&D efficiency through outstanding product performance. Public data show that as of 2025, Biren Technology has filed over 1,500 patent applications across multiple countries and regions—ranking first among Chinese general-purpose GPU companies—and has been granted more than 600 patents, placing it among the top in the Chinese GPU sector. Its invention patent grant rate stands at 100%, the highest among domestic enterprises. In addition, Biren Technology has twice received the highest award—the SAIL Award—at the World Artificial Intelligence Conference, took the lead in commercial deployment of optical interconnect technology, and has been recognized as a National Key "Little Giant" enterprise (specialized and sophisticated SME).


  ![](/static/img/biren_20260102-2-.jpeg)


  **Domestic Computing Power Empowers All Industries: Entering a New Phase of Scalable Growth**


  With practical, reliable, and innovative products and solutions, Biren Technology's products have been deployed in key industries including AI data centers, telecommunications, AI solutions, energy and utilities, fintech, and internet services. They have been scaled across multiple AI computing clusters nationwide, effectively supporting core application scenarios such as AI training, inference services, and scientific research. The customer base covers nine Fortune China 500 companies (including five Fortune Global 500), and Biren has achieved scaled commercial deployment of domestic computing clusters with all three major telecom operators—closing the loop from technological breakthroughs to market validation.


  Since the official commercialization of its Bili™ chip products in 2023, Biren Technology has demonstrated strong growth momentum. Revenue grew from RMB 62.03 million that year to RMB 337 million in 2024. With the mass production and market launch of the Bili™ 166 chip product, Biren achieved another leap in growth in 2025. As of December 15, 2025, the company's order backlog reached RMB 1.241 billion. Beyond its existing product portfolio, Biren plans to launch the BR20X series, a next-generation flagship data center chip developed on its second-generation architecture, for cloud training and inference, with commercial availability expected in 2026, which is poised to unlock significant further market potential.


  **From Follower to Runner-Up: Building a Domestic Intelligent Computing Industry Ecosystem**


  2026 marks the first year of the "15th Five-Year Plan" period. The "Recommendations for the 15th Five-Year Plan" highlight artificial intelligence development as a future priority, with the term "artificial intelligence" mentioned eight times and "computing power" twice, calling for AI to lead changes in research paradigms and seize the high ground in AI industrial applications.


  China is deeply implementing the "AI+" initiative, creating broad application scenarios for AI computing chips and driving explosive growth in demand for various types of computing chips. Against the backdrop of national strategy and accelerating domestic substitution, Biren Technology's technical strength and product portfolio are well aligned with policy directions and the urgent market need for independent and controllable computing power. Seizing this development opportunity, Biren's Hong Kong listing will raise funds to accelerate next-generation product iteration and technological innovation, including the development of intelligent computing hardware, software platform upgrades, and commercialization of intelligent computing solutions, all with the long-term goal of driving technological progress and accelerating AI applications.


  Standing at a brand new starting point, Biren Technology will unswervingly pursue its strategic mission of "domestic chip design, domestic manufacturing, domestic deployment, and domestic application." It will continue to strengthen R&D investment, enhance core technology self-reliance, deepen collaborative innovation across the industrial chain, and provide powerful, efficient, and secure computing infrastructure to become a cornerstone supporting China's digital economy and AI industry development.


  Yue Bin, Founding Partner of Gaorong Ventures, commented: "The high-end general-purpose intelligent chip business is a challenging endeavor, much like scaling a towering cliff—it requires a mature team that can navigate both technology and business cycles. Biren has a clear understanding of the long-cycle, high-difficulty nature of the industry, while demonstrating outstanding comprehensive capabilities across core technology, talent, capital, ecosystem, and other dimensions. They have the courage and the foundation to keep climbing upward, and they are the kind of aggressive players that match this era and dare to stand at the forefront. Over the past few years, Biren has fully validated its R&D strength and product reliability, and has shown impressive growth potential in commercialization. Listing is a new starting point—we look forward to Biren continuing its journey toward the future of domestic GPGPUs and AI chip ecosystems, constantly pushing the boundaries of computing efficiency."


  ![](/static/img/birem_20260102-3-.png)
pic: /static/img/abstract_biren_20260102.jpeg
---
