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Update News “3d传感器芯片和解决方案提供商「灵明光子」完成亿元级c-轮融资”

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title: 3D传感器芯片和解决方案提供商「灵明光子」完成亿元级C+轮融资 title: 3D传感器芯片和解决方案提供商「灵明光子」完成亿元级C+轮融资
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type: 新技术
createDate: 2023-06-01T01:09:07.896Z createDate: 2023-06-01T01:09:07.896Z
abstract: 近日，3D传感器芯片和解决方案提供商灵明光子完成亿元级C+轮融资，投资方为基石资本、谷雨嘉禾资本等机构。高榕资本曾于2021年领投灵明光子B1轮融资，并在C轮融资中继续加注。 abstract: 近日，3D传感器芯片和解决方案提供商灵明光子完成亿元级C+轮融资，投资方为基石资本、谷雨嘉禾资本等机构。高榕资本曾于2021年领投灵明光子B1轮融资，并在C轮融资中继续加注。
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